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3D Memory Chip Architect and Design, Principal Engineer

at Qualcomm

Back to all C/C++ jobs
Qualcomm logo
Industry not specified

3D Memory Chip Architect and Design, Principal Engineer

at Qualcomm

Tech LeadNo visa sponsorshipC/C++/C#

Posted 17 hours ago

No clicks

Compensation
Not specified

Currency: Not specified

City
San Diego
Country
United States

**Principal Engineer needed for 3D Memory Chip Architect role. Design and innovate next-gen 3D memory chip solutions. Experienced in VLSI circuit design, with strong knowledge of 3D integration technologies. Proven expertise in designing high-density, high-speed memory structures. Adept in Cadence Virtuoso, Synopsys PrimeTime, and industry-standard verification tools. Senior-level position, requires 10+ years in memory chip design, with experience in 3D-IC technology.**

No additional description provided.

3D Memory Chip Architect and Design, Principal Engineer

at Qualcomm

Back to all C/C++ jobs
Qualcomm logo
Industry not specified

3D Memory Chip Architect and Design, Principal Engineer

at Qualcomm

Tech LeadNo visa sponsorshipC/C++/C#

Posted 17 hours ago

No clicks

Compensation
Not specified

Currency: Not specified

City
San Diego
Country
United States

**Principal Engineer needed for 3D Memory Chip Architect role. Design and innovate next-gen 3D memory chip solutions. Experienced in VLSI circuit design, with strong knowledge of 3D integration technologies. Proven expertise in designing high-density, high-speed memory structures. Adept in Cadence Virtuoso, Synopsys PrimeTime, and industry-standard verification tools. Senior-level position, requires 10+ years in memory chip design, with experience in 3D-IC technology.**

No additional description provided.

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