
3D Memory Chip Architect and Design, Principal Engineer
at Qualcomm
Posted 17 hours ago
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- Compensation
- Not specified
- City
- Country
- United States
Currency: Not specified
**Principal Engineer needed for 3D Memory Chip Architect role. Design and innovate next-gen 3D memory chip solutions. Experienced in VLSI circuit design, with strong knowledge of 3D integration technologies. Proven expertise in designing high-density, high-speed memory structures. Adept in Cadence Virtuoso, Synopsys PrimeTime, and industry-standard verification tools. Senior-level position, requires 10+ years in memory chip design, with experience in 3D-IC technology.**
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