
IC Package Design Engineer
at Qualcomm
Posted 16 hours ago
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- Compensation
- Not specified
- City
- Country
- United States
Currency: Not specified
**IC Package Design Engineer**: Design integrated circuit (IC) packages, optimize power/thermal performance, and ensure compliance with mechanics, reliability, and assembly rules. Proficient in CAD and TCAD tools (e.g.,/package/Davidson/ScanCAD, ANSYS Icepak). 5+ years' experience in IC package design, B.S. or M.S. in Electrical/Mechanical Engineering. Collaborate with cross-functional teams in a semiconductor or IC packaging environment. Expertise in IC packaging redesign and DFM desired.
No additional description provided.
