[2026 TSMC US Fall Campus Recruitment] Advanced Packaging Technology and Service Engineer (APTS)
at TSMC
Posted a day ago
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- United States
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**Advanced Packaging Technology & Service Engineer (APTS) - Fall '26 Camp @ TSMC US** Power TSMC's US expansion as an **Advanced Packaging Technology & Service Engineer (APTS)**. Key responsibilities: drive **packaging technology development**, optimize process flows, and ensure **zero-defect manufacturing**. Essential skills: proficiency in **IC packaging**, experience with **fan-out** technologies, familiarity with **WoW+**, and **仿ECP** technologies. Requires a **BS/MS in Materials Science/Electrical/Electronic Engineering** and **5-10 years of relevant experience**. Candidate should be results-driven, with strong **process engineering** and **DfX** skills. Proficient in **Python, R, ANSYS**, and ** revendor tools**. Bilingual (Mandarin/English) a plus.
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