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[2026 TSMC US Fall Campus Recruitment] Advanced Packaging Technology Development (APTD)
at TSMC
InternshipNo visa sponsorshipOther
Posted a day ago
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- Compensation
- Not specified
- City
- Country
- United States
Currency: Not specified
**APTD Engineer-role enables TSMC's 2026 Fall Campus Recruiters to shape predictive IC packaging. Responsibilities: Design 3D-IC and fan-out structures; optimize material and/or process; collaborate with cross-functional teams. Required: Master's in Materials Science or Electrical Engineering; proficiency in ASP/Polygons/OVL; 1-3 years of nanoscale packaging experience.**
No additional description provided.
