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[2026 TSMC US Fall Campus Recruitment] Process Integration Engineer (PIE)

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**2026 TSMC US Fall Campus Recruitment: Process Integration Engineer (PIE)** PIEs harmonize chip designs and manufacturing. Key responsibilities involve collaboratively advancing process integration, driving yield improvement, and ensuring design-to-silicon flow. Required skills include semiconductor process knowledge, CAdence Virtuoso, Python/R scripting, and GPU/CPU architectures. A BS/MS in Electrical/Computer Engineering, with 0-3 years of industry experience, is preferred.