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【2027 TSMC RDSS&AO】Advanced Packaging Technology and Service Engineer (APTS)

at TSMC

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【2027 TSMC RDSS&AO】Seeking experienced Advanced Packaging Technology and Service Engineer (APTS) for research, development, and characterization of advanced packaging solutions. Key responsibilities include: collaborative cross-functional teamwork, process optimization, and technical training. Proficient in 3D-IC, fan-out wafer-level packaging, RDL technologies, and dry/wet process knowledge. Requires minimum 5 years' experience. Proficiency in Python, Six Sigma, and hands-on lab experience essential.