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【2027 TSMC RDSS&AO】Advanced Packaging Technology Development (APTD)

at TSMC

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Posted 21 hours ago

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**Senior Advanced Packaging Engineer (TSMC APTD)** sought for cutting-edge technology development. **Key Responsibilities**: Drive packaging technology roadmap, collaborate cross-functionally on technical challenges, and manage ATE test/evaluation. **Required Skills**: Proficient in 2.5D/3D packaging, familiar with CAD/CAE tools, strong analytical/experimental skills, and experienced in R&D/S&A. **Experience Level**: 8+ years in packaging-related roles. **Domain**: Semiconductor industry expertise preferred.