Change the world. Love your job.
In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.

Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? As a Texas Instruments Equipment Engineer, you will have the opportunity to work in a vibrant and dynamic team-oriented environment.

Responsibilities include:

•    Lead and sustain package sawing equipment to achieve high machine OEU, productivity, and process stability.
•    Perform preventive, corrective, and predictive maintenance to ensure equipment reliability.
•    Troubleshoot equipment, process, and product-related issues using structured problem-solving methodologies (e.g., 8D, 5 Why, Fishbone).
•    Optimize machine parameters to improve yield, throughput, and overall equipment effectiveness (OEU).
•    Drive continuous improvement initiatives to reduce downtime, maintenance cost, and process variation.
•    Team player and collaborate with Process, Manufacturing, Quality, and Production teams to resolve technical issues and support production goals.
•    Lead equipment qualification, installation, acceptance, and process buy-off for new tools and technology transfers.
•    Analyze equipment performance data and establish action plans to improve MTBA, and equipment availability.
•    Develop and maintain maintenance procedures, work instructions, FMEA, PM checklists, and technical documentation.
•    Support engineering projects, cost reduction initiatives, automation improvements, and compliance with safety and quality standards.
 

Minimum requirements:

• Bachelor’s Degree in Mechanical Engineering, Electrical Engineering, Mechatronics Engineering, Electronics Engineering, or a related engineering discipline.
• Fresh graduate or less than 2 years of hands-on experience in semiconductor backend manufacturing, preferably in package sawing/dicing processes.

Preferred qualifications:

• Knowledge of AMAT PVD and/or AMAT TxZ chambers equipment
• Knowledge of PVD, CVD, high vacuum and/or ultra high vacuum
• Knowledge of other equipment (e.g., AMAT, Veeco, TEL, Novellus, and/or ASM)
• Understanding of tool monitoring and interdiction software, and equipment maintenance and documentation
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationships