芯片贴装设备工程师/Die Attach Equipment Engineer
at Texas Instruments
Posted 9 minutes ago
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- Compensation
- Not specified
- City
- Country
- China
Currency: Not specified
**Die Attach Equipment Engineer (芯片贴装设备工程师)** Key Responsibilities: - Day-to-day maintenance, repairs, and preventive upkeep of Die Attach maquinaria full production suites - Draft equipment procurement standards, installations, parameter calibration, upgrades, and OEE management - Expedite line stoppage issues, output fault analysis reports, minimize downtime - Develop maintenance manuals, point checks, inventory management for materials and spares - Collaborate with original equipment manufacturers for repairs and updates Basic Qualifications: - Full-time Bachelor's degree or above in relevant fields such as Microelectronics, Electronic Information, Materials Engineering, Mechanical Automation, or Control Engineering - A minimum of 3 years of experience in semiconductor packaging & testing production environments - Proficiency in industry standards, production SOPs, anomaly analysis, 8D reports, and yield optimization - Ability to work cross-functionally and independently, understanding clean room production norms Preferred: - Experience with ASM, BESI, or other leading Die Attach equipment structures
岗位职责：
1. 负责Die Attach 固晶产线全套生产设备日常运维、故障维修、预防性保养、备件管理；
2. 负责制定设备采购规格书，安装调试、量产参数校准、设备技改升级、产线设备稼动率管控；
3. 处理产线突发设备停机故障，输出设备故障分析报告，降低设备宕机损耗；
4. 编制设备保养手册、设备点检标准；管控设备耗材、备品备件库存；
5. 对接设备原厂完成设备维修、版本升级、硬件改造工作。
任职基本要求：
1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；
2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；
3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；
4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件；
加分项：
熟悉ASM、Besi等主流固晶机结构与运维逻辑优先。
