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Director, IC Packaging Engineering – Mechanical Simulation
at Qualcomm
Tech LeadNo visa sponsorshipOther
Posted 3 hours ago
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**Director, IC Packaging Engineering – Mechanical Simulation** leads team in advanced packaging, optimizing mechanical design using CAE tools. Key responsibilities include IC package level thermal-mechanical analysis, managing projects, and driving technology roadmap. Required skills: proficient in ANSYS & Coventor, 10+ years' experience in IC packaging, BS/MS in Mechanical/Electrical Engineering.
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