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IC Packaging Staff Engineer - Assembly process/Characterization

at Qualcomm

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Posted 18 hours ago

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**IC Packaging Staff Engineer (Assembly Process/Characterization)** needed for semiconductor firm. Lead assembly & characterization processes. Handle high-volume production, improve yields. Proficient in thermosonic, epoxy, and wire bonding. Familiar with packaging equipment and tools like wedge bonder, die shooter, and die bonder. Requires BSc in Materials Science or related field, plus 5+ years' experience in IC packaging. Skills: process engineering, statistical analysis, root cause analysis. Collaborate cross-functionally for improved product quality.