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Interim Engineering Intern_2027_HW

at Qualcomm

InternshipNo visa sponsorshipOther

Posted 17 hours ago

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电子工程实习생（暂编Limited 2027_HW）： 设计和实际验证数字电路。使用HDL（VHDL、Verilog）为SoC开发 firmeware/IP。要求： फ़coli nsight/.sw elicta、ASIC和FPGA设计经验，逻辑 minst rels before eles over jou jrators。需 3+naire Level Engineer或相关领域经验。