Home Careers Search jobs Memory Device & Process Integration Expert (Technical Roadmap) Apply Now In a nutshell Location Hwasung, Korea Team Research and Technology Development Work experience 10-15 years, 16+ years Educational background Physics Chemical Engineering Materials Science Electrical Engineering Other technical backgrounds Travel 10% Workplace type Hybrid Fulltime/parttime Full time Share this job Job ID: J-00349369 Principal Applications Scientist, Memory Device & Process Integration Location: Korea Introduction to the role ASML’s Technology Development Center, TDC, helps shape the company’s long-term technology direction by connecting semiconductor industry developments with future product and technology roadmaps. We are looking for an experienced memory technology professional to analyze future memory device architectures and process-integration challenges from a global industry perspective. The primary focus of the role will be advanced DRAM device architecture and process integration, covering major technology paths and customer-specific approaches across the global DRAM industry. In this role, you will own assigned DRAM-related technical topics, develop the underlying technology scenarios and roadmap inputs, and translate your insights into relevant implications for ASML product and technology roadmaps. You may also contribute to broader memory technology discussions where your expertise and analytical perspective are relevant. You will collaborate with experts across ASML, customers, research organizations and external technology partners. The position is based in Korea, while its technology and stakeholder scope is global. Roles and responsibilities • Analyze future DRAM device, cell and array architectures and their process-integration implications. • Reconstruct and evaluate process-integration flows for evolving and emerging DRAM architectures. • Assess the interaction between device architecture, layout, materials, dimensions and process conditions. • Identify physical limits, critical dependencies, integration risks and unresolved technical challenges. • Follow relevant developments through customer inputs, publications, patents, conferences, internal sources and expert discussions. • Develop and evaluate technical hypotheses using incomplete, evolving and sometimes conflicting information. • Compare alternative technology paths and identify the conditions required for their technical feasibility and transition. • Clearly distinguish technical evidence, assumptions, interpretations and uncertainties. • Develop and maintain technology roadmaps for assigned DRAM device and process-integration topics, including their technical basis, alternative scenarios and open questions. • Identify critical layers, process steps and requirements arising from future DRAM architectures. • Translate device and process-integration developments into relevant implications for ASML technology areas. • Work with experts across technical disciplines to validate assumptions and develop technically grounded recommendations. • Contribute DRAM technology insights and roadmap inputs to the overall TDC memory roadmap and relevant ASML product and technology discussions. • Provide technical guidance and knowledge transfer to stakeholders with different technical backgrounds. • Participate in and, where appropriate, lead technical discussions with customers, research organizations and technology partners. Education and experience • Master’s degree or PhD in Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering or a related scientific or engineering discipline. • Proven industry or research experience in memory device development, device integration or process integration. • Demonstrated experience analyzing complex device structures and process-integration flows. • Experience independently driving complex technical topics from problem definition through analysis and recommendation. • Experience working across technical disciplines to develop and validate conclusions. • Experience translating detailed technical analysis into technology direction, roadmap input or organizational recommendations. Skills • Deep understanding of semiconductor device physics, device architecture or process integration in at least one memory technology area. • Ability to connect device requirements and unit processes with the overall integration flow. • Ability to identify physical limitations, critical integration dependencies and potential technical risks. • Ability to decompose complex technical questions into key variables and testable hypotheses. • Ability to develop credible technical scenarios from incomplete or conflicting information. • Ability to compare multiple technology paths without prematurely converging on a single scenario. • Ability to communicate the basis, validity range and uncertainty of technical conclusions. • Ability to independently own a defined technical domain while actively seeking