Industry not specified

Process Engineer (RDPC - 3DIC)

at TSMC

GraduateNo visa sponsorshipOther

Posted a day ago

No clicks

Compensation

Not specified

Currency: Not specified

City

Not specified

Country

Not specified

**Process Engineer (RDPC - 3DIC) Needed**: Streamline semiconductor manufacturing by optimizing 3D Integrated Circuit (3DIC) processes. Key responsibilities include process development, adherence to TCVS (Through Silicon Via) and µbump technology, and ensuring high-yield, low-defect production. Required skills: proficient in full process flow from design to Fab, experienced with 200mm wafers, and knowledgeable in deposition, etching, and CMP processes. Minimum 5+ years in semiconductor fabrication. Familiarity with relevant tools like Ashley or Criticom software and experience with process modeling and DOE techniques is a plus.