Process Engineer – Wafer Bumping, Wafer Singulation, Wafer Grinding & Wafer Mounting

at Qualcomm

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Process Engineer – Wafer Bumping, Wafer Singulation, Wafer Grinding & Wafer Mounting

at Qualcomm

Mid LevelNo visa sponsorshipOther

Posted 17 hours ago

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Compensation: Not specified
City: Not specified
Country: United States

**Process Engineer – Wafer Bumping, Singulation, Grinding & Mounting** leads end-to-end semiconductor process improvement. Responsible for optimizing **wafer bumping**, **singulation**, **grinding**, and **mounting** operations. Proficient in **MES**, **yield management**, and using **Six Sigma** tools. Bachelor's in Engineering mandatory; 5+ years in relevant semiconductor roles. Familiarity with **Atomic Force Microscopy (AFM)** and ** Wafer Mapping Software** essential.

No additional description provided.