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R&D先進封裝技術發展
at TSMC
Mid LevelNo visa sponsorshipOther
Posted a day ago
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**R&Dushed Packaging Tech Dev Specialist:** Pioneers advanced packaging solutions. Key tasks: Novel design, material innovation, prototyping. Necessary skills: Packaging engineering, materials science, CAD/CAM. Requires 5+ years in R&D, proficiency in SolidWorks, finite element analysis. Chinese language proficiency beneficial. Collaborate cross-functionally, drive projects from inception to launch.
No additional description provided.
