Industry not specified

RDPC 3DIC_儲備模組副工程師(MAE)_台中AP5

at TSMC

GraduateNo visa sponsorshipOther

Posted 10 minutes ago

No clicks

Compensation

Not specified

Currency: Not specified

City

Not specified

Country

Not specified

**Senior IC Design Engineer (TSMC 3DIC/Interposer) - Taichung, Taiwan** Design and develop next-generation 3D IC and interposer products using TSMC's advanced processes. Key responsibilities include architecture, circuit design, simulation, and physical implementation. Requires a minimum of 7 years of experience in IC design with proficiency in Cadence, Synopsys tools, andluent in Python or TCL. Strong background in power and signal integrity, timing closure, and STA. Familiarity with TSMC's design rules and DFM considerations essential.