可靠性工程师/Reliability Engineer
at Texas Instruments
Posted 15 minutes ago
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**Reliability Engineer (可靠性工程师)** - **Job Summary:** - Design and execute reliability test strategies for semiconductor packages and intermediates. - Conduct HAST, TC, HTOL, MSL, reflow, high/low temp shock, and wet-hot aging tests. - Analyze product failures, assess reliability risks, and identify root causes in packaging processes. - Establish product reliability standards, manage controls, and facilitate third-party reliability audits (AEC-Q100/JEDEC). - Drive improvement projects, resolve reliability issues, and cultivate a reliability database. - **Requirements:** - **Education:** Full-time bachelor's degree or above in relevant STEM fields (e.g., Microelectronics, Electronics, Material Science, Mechanical Automation, or Test & Control). - **Experience:** At least 3 years in semiconductor packaging test production, with a solid understanding of packaging processes and line operations. - **Skills:** Proficiency in industry standards, production SOPs, problem-solving, 8D reporting, and yield optimization. Ability to collaborate cross-functionally and use Office tools effectively. - **Attributes:** Strong logical thinking, independently troubleshoots and pushes projects forward. Familiarity with clean room production rules, flexible scheduling, and office tool proficiency.
岗位职责：
1. 负责半导体封装成品、半成品可靠性测试方案制定、实验执行与报告输出；
2. 开展HAST、TC、HTOL、MSL、回流焊、高低温冲击、湿热老化等封装可靠性实验；
3. 完成产品失效分析、可靠性风险评估，定位封装制程导致的产品失效根因；
4. 制定产品可靠性标准、管控规范，对接客户完成第三方可靠性审核；
5. 针对可靠性不良推动工艺、设备、设计部门完成闭环整改，沉淀可靠性数据库；
6. 熟悉AEC-Q100/JEDEC半导体行业可靠性标准。
任职基本要求：
1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；
2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；
3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；
4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件；
