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Staff IC Packaging Engineer - Mechanical Simulation

at Qualcomm

Tech LeadNo visa sponsorshipOther

Posted 5 hours ago

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Staff IC Packaging Engineer for mechanical simulation role requires experienced professional to optimize package-level thermal-mechanical behavior. Manage CTE and TCE, create FEA models in ANSYS Mechanical and/or COMSOL Multiphysics. Develop and validate packaging solutions, collaborate with cross-functional teams. 5+ years IC packaging experience, proficiency in mechanical simulations, strong problem-solving skills needed. BS MS/PhD degree in relevant engineering field.