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Substrate / Advanced Packaging Manager
at TSMC
Tech LeadNo visa sponsorshipProduct/Project Manager
Posted 21 hours ago
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**Substrate/Advanced Packaging Manager.** Lead semiconductor packaging, manage substrate & ADVANCED PACKAGING technologies. Key responsibilities: TEAM Leadership, PROCESS Optimization, COST Reduction & Quality Assurance. Proven experience (10+ Yrs) in SUBSTRATE & ADVANCED PACKAGING, strong knowledge of packaging processes & equipment, experience in cost analysis & reduction.
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