ELECTRICAL ENGINEER, SILICON RELIABILITY TEST (STARLINK)

As an electrical engineer on the Starlink silicon reliability team, you'll sit at the intersection of electrical, packaging, semiconductor, and manufacturing engineering. You will be responsible for package-level and wafer-level reliability testing, including HTOL and other accelerated life tests, root cause of silicon and packaging failures, and driving design and process changes to improve microelectronics reliability across Starlink devices. Your focus will be on the qualification of new silicon packages, wafer-level reliability, and supporting high-volume production.

RESPONSIBILITIES:

• Own package-level (HTOL, LTOL, etc.) and wafer-level (TDDB, ECM, etc.) reliability qualification and testing of new silicon designs and manufacturing technologies for high-volume production
• Plan, develop, execute, and analyze reliability test campaigns aligned with JEDEC and related standards
• Develop and procure custom test hardware, fixturing, burn-in boards, and environmental chambers/systems required for package-level and wafer-level reliability testing
• Design and develop PCBs and electrical interfaces for reliability test fixtures, sockets, and monitoring systems
• Develop software, automation scripts, and data acquisition tools (e.g., Python) to control test equipment, log telemetry, perform real-time monitoring, and analyze large reliability datasets
• Perform hands-on debugging and electrical characterization to drive root cause and corrective action of silicon, package, and interconnect failures observed in reliability testing, production, or the field
• Utilize advanced diagnostic and test tools (oscilloscopes, power supplies, vector network analyzers, custom firmware/scripts, thermal chambers, etc.) to characterize devices under stress and isolate failure mechanisms
• Run reliability failure investigations, coordinating efforts across silicon design, packaging, manufacturing, and reliability teams, and communicating findings to leadership
• Analyze reliability data (Weibull, acceleration models, etc.) to predict field performance, document failure modes, and drive design/process improvements for higher yield and reliability
• Partner with design, packaging, software, test, and manufacturing engineering teams to deliver reliable silicon hardware by informing product design, package selection, process changes, and test coverage

BASIC QUALIFICATIONS:

• Bachelor’s degree in electrical engineering, electronics engineering, or other engineering discipline

PREFERRED SKILLS AND EXPERIENCE:

• 1+ years of experience in semiconductor reliability, packaging reliability, consumer electronics, aerospace, automotive, or similar high-reliability industry
• Masters degree or PhD in electrical engineering, electronics engineering, or a related field with a focus on semiconductors, characterization, or test
• Hands-on experience with HTOL or other accelerated life tests for packages or TDDB, EM, HCI, and other wafer-level tests
• Experience developing or procuring custom test hardware, burn-in boards, sockets, or fixturing for reliability testing
• Experience designing PCBs for test fixtures or high-reliability applications
• Familiarity with programming and automation/scripting languages (Python preferred; C++, SQL, or similar) for test control, data logging, and analysis
• Proficiency in understanding PCB schematics, layout tools, and electrical interfaces for semiconductor packages
• Knowledge of JEDEC (JESD22), AEC-Q200/AEC-Q100, MIL-STD-202/883, IPC, or related reliability standards and physics-of-failure methods
• Experience in a fast-paced, iterative design/manufacturing environment within semiconductor, consumer electronics, aerospace, automotive, or related industries

ADDITIONAL REQUIREMENTS:

• Ability to work overtime and weekends as needed