职责 | Responsibilities: 为客户技术团队提供现场应用支持，与客户直接接口人建立稳固的合作关系Provide on-site application support to customers' technical teams and establish strong working relationships with key customer contacts. 与客户定期召开会议并反馈客户的关键需求给公司。Hold regular meetings with customers and communicate critical customer requirements back to the company. 日常工作包括直接在客户公司提供现场支持，以及通过电话、邮件等方式与客户保持沟通，分析问题并及时为客户提供解决方案。Deliver on-site support at customer locations and maintain communication through phone calls, emails, and other channels; analyze issues and provide timely solutions. 一线支持职责：产品组、研发组以及客户之间的沟通桥梁。Serve as the primary communication bridge among Product Engineering, R&D teams, and customers. 产品支持：专注于针对先进节点的产品方案的调试，监控并推动客户项目的进展。Provide product support with a focus on debugging and optimizing solutions for advanced technology nodes; monitor and drive customer project progress. 客户反馈：协调和推动向客户提供的技术反馈。Coordinate and facilitate technical feedback delivery to customers. 项目职责：同客户、产品工程师一起制定技术指标和项目计划，起草项目规划、定期召开总结会议。Work with customers and product engineers to define technical targets and project plans; prepare project roadmaps and conduct regular project review meetings. 向产品及研发工程师报告技术需求和技术问题。Report customer technical requirements and issues to Product and R&D Engineering teams. 使用JIRA文档系统，管理客户案例。Manage customer cases using the JIRA documentation and tracking system. 开展现场培训以及协调客户的培训需求。Conduct on-site training sessions and coordinate customer training requirements. 每周追踪并定期报告客户项目进度。Track customer project progress on a weekly basis and provide regular status reports. 本职位要求一定程度的出差。Domestic and international travel may be required as part of this role. 要求 | Qualifications: 物理、光学、计算机科学、化学工程、材料科学、数学等相关专业，硕士及以上学历。Master's degree or above in Physics, Optics, Computer Science, Chemical Engineering, Materials Science, Mathematics, or related disciplines. 熟悉OPC以及光刻技术。Solid knowledge of Optical Proximity Correction (OPC) and lithography technologies. 有良好的问题分析和解决能力。Strong analytical and problem-solving skills. 良好的沟通、计划组织、协作以及人员/项目领导能力。Excellent communication, planning, organizational, collaboration, and project leadership capabilities. 较强的人际交往能力以及在不同环境的工作适应能力。Strong interpersonal skills and the ability to adapt effectively to different working environments. 流利的英语表达能力。Fluent English communication skills, both written and verbal. 有掩膜版设计制造、物理版图设计、光刻及其它晶圆处理工艺方面背景优先。Experience in mask design and manufacturing, physical layout design, lithography, or other wafer processing technologies is highly preferred.