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Product Quality and Reliability Engineer

at Intel

Back to all Data Science / AI / ML jobs
I
Industry not specified

Product Quality and Reliability Engineer

at Intel

Tech LeadNo visa sponsorshipData Science/AI/ML

Posted 7 hours ago

No clicks

Compensation
Not specified

Currency: Not specified

City
Bengaluru
Country
India

Join Intel's Product Quality and Reliability (PQN) organization to drive reliability modeling, QRV planning, data collection, and risk assessment across the product life cycle for leading-edge client CPUs. You will develop reliability prediction models, define and execute QRV plans, analyze QRV data, debug failures, and translate results into customer risk assessments while collaborating with design, test engineering, and packaging teams. The role involves delivering failure estimates via reliability simulation tools, optimizing test flows, supporting Product Release Qualification (PRQ), and ensuring compliance with silicon and packaging qualification data requirements including HTOL, ESD, Latch-up, RFI, DPZ, and related tests. Strong communication and data analysis skills, with semiconductor know-how, are essential.

Job Details:

Job Description: 

Join Intel’s PQN organization and play a key role in ensuring the quality and reliability of cutting-edge client microprocessor products (primarily laptop and desktop CPUs). As a Product Quality and Reliability Engineer, you will drive reliability modeling, qualification data collection, and risk assessments throughout the Product Life Cycle (PLC).

Key Responsibilities-

  • Develop and maintain reliability prediction models for leading-edge client microprocessors.
  • Define and execute Quality and Reliability Validation (QRV) plans for product qualification.
  • Collect and analyze QRV data, debug failures, and translate results into customer risk assessments.
  • Provide reliability risk assessments for new features, performance enhancements, and varied use conditions.
  • Collaborate with cross-functional teams (design, test engineering, product qualification, process technology) to resolve reliability roadblocks.
  • Deliver failure estimates using state-of-the-art reliability simulation tools.
  • Optimize test flows to reduce cost while maintaining quality standards.
  • Support Product Release Qualification (PRQ) and manage post-PRQ issues to ensure consistent quality.
  • Design and execute reliability experiments, analyze results, and integrate findings into models.
  • Act as the voice of quality in project management forums, ensuring PLC criteria are met.
  • Ensure awareness and compliance with silicon and packaging qualification data collection requirements, including ESD, Latch-up, RFI, DPZ, Early Life Failure, extended HTOL (High Temperature Operating Life) testing, as well as package-level qualifications such as TCB (Thermal Cycling Bake), HAST (Highly Accelerated Stress Test), and Bake.

Qualifications:

Minimum Qualifications-

  • Bachelor’s degree in Electrical Engineering, Physics, or related field. 10+ years of experience in areas such as Electrical Engineering, Physics, Material Science, Quality & Reliability, Fab Yield, Assembly, Validation, Product Design, or Test Engineering.
  • Master’s degree in Electrical Engineering, Physics, or related field. 8+ years of experience in areas such as Electrical Engineering, Physics, Material Science, Quality & Reliability, Fab Yield, Assembly, Validation, Product Design, or Test Engineering.
  • PhD’s degree in Electrical Engineering, Physics, or related field. 5+ years of experience in areas such as Electrical Engineering, Physics, Material Science, Quality & Reliability, Fab Yield, Assembly, Validation, Product Design, or Test Engineering.
  • 3+ years of experience in data analysis.
  • Strong knowledge of semiconductor devices, circuit design, and/or computer architecture.
  • Proven technical and analytical problem-solving skills.
  • Ability to work across global time zones (USA, Israel, Costa Rica, Malaysia).

Preferred Qualifications-

  • Master’s or Ph.D. in Electrical Engineering, Physics, or related field.
  • Experience in semiconductor manufacturing, packaging, and device physics.
  • Familiarity with process certification and reliability risk assessment.
  • Hands-on experience with Etest, Sort, and Class data extraction and analysis.
  • Proficiency in statistical tools (JMP).
  • Strong presentation and communication skills.
  • Six Sigma certification and prior experience in quality/reliability engineering are a plus.

Behavioral Traits-

  • High tolerance for ambiguity and ability to define strategies efficiently.
  • Self-starter with a willingness to take informed risks.
  • Advanced problem-solving and analytical skills.
  • Excellent communication, presentation, and time management skills.

Job Type:

Experienced Hire

Shift:

Shift 1 (India)

Primary Location: 

India, Bangalore

Additional Locations:

Business group:

The Silicon Engineering Group (SIG) is a worldwide organization focused on the development and integration of SOCs, Cores, and critical IPs from architecture to manufacturing readiness that power Intel’s leadership products. This business group leverages an incomparable mix of experts with different backgrounds, cultures, perspectives, and experiences to unleash the most innovative, amazing, and exciting computing experiences.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Product Quality and Reliability Engineer

at Intel

Back to all Data Science / AI / ML jobs
I
Industry not specified

Product Quality and Reliability Engineer

at Intel

Tech LeadNo visa sponsorshipData Science/AI/ML

Posted 7 hours ago

No clicks

Compensation
Not specified

Currency: Not specified

City
Bengaluru
Country
India

Join Intel's Product Quality and Reliability (PQN) organization to drive reliability modeling, QRV planning, data collection, and risk assessment across the product life cycle for leading-edge client CPUs. You will develop reliability prediction models, define and execute QRV plans, analyze QRV data, debug failures, and translate results into customer risk assessments while collaborating with design, test engineering, and packaging teams. The role involves delivering failure estimates via reliability simulation tools, optimizing test flows, supporting Product Release Qualification (PRQ), and ensuring compliance with silicon and packaging qualification data requirements including HTOL, ESD, Latch-up, RFI, DPZ, and related tests. Strong communication and data analysis skills, with semiconductor know-how, are essential.

Job Details:

Job Description: 

Join Intel’s PQN organization and play a key role in ensuring the quality and reliability of cutting-edge client microprocessor products (primarily laptop and desktop CPUs). As a Product Quality and Reliability Engineer, you will drive reliability modeling, qualification data collection, and risk assessments throughout the Product Life Cycle (PLC).

Key Responsibilities-

  • Develop and maintain reliability prediction models for leading-edge client microprocessors.
  • Define and execute Quality and Reliability Validation (QRV) plans for product qualification.
  • Collect and analyze QRV data, debug failures, and translate results into customer risk assessments.
  • Provide reliability risk assessments for new features, performance enhancements, and varied use conditions.
  • Collaborate with cross-functional teams (design, test engineering, product qualification, process technology) to resolve reliability roadblocks.
  • Deliver failure estimates using state-of-the-art reliability simulation tools.
  • Optimize test flows to reduce cost while maintaining quality standards.
  • Support Product Release Qualification (PRQ) and manage post-PRQ issues to ensure consistent quality.
  • Design and execute reliability experiments, analyze results, and integrate findings into models.
  • Act as the voice of quality in project management forums, ensuring PLC criteria are met.
  • Ensure awareness and compliance with silicon and packaging qualification data collection requirements, including ESD, Latch-up, RFI, DPZ, Early Life Failure, extended HTOL (High Temperature Operating Life) testing, as well as package-level qualifications such as TCB (Thermal Cycling Bake), HAST (Highly Accelerated Stress Test), and Bake.

Qualifications:

Minimum Qualifications-

  • Bachelor’s degree in Electrical Engineering, Physics, or related field. 10+ years of experience in areas such as Electrical Engineering, Physics, Material Science, Quality & Reliability, Fab Yield, Assembly, Validation, Product Design, or Test Engineering.
  • Master’s degree in Electrical Engineering, Physics, or related field. 8+ years of experience in areas such as Electrical Engineering, Physics, Material Science, Quality & Reliability, Fab Yield, Assembly, Validation, Product Design, or Test Engineering.
  • PhD’s degree in Electrical Engineering, Physics, or related field. 5+ years of experience in areas such as Electrical Engineering, Physics, Material Science, Quality & Reliability, Fab Yield, Assembly, Validation, Product Design, or Test Engineering.
  • 3+ years of experience in data analysis.
  • Strong knowledge of semiconductor devices, circuit design, and/or computer architecture.
  • Proven technical and analytical problem-solving skills.
  • Ability to work across global time zones (USA, Israel, Costa Rica, Malaysia).

Preferred Qualifications-

  • Master’s or Ph.D. in Electrical Engineering, Physics, or related field.
  • Experience in semiconductor manufacturing, packaging, and device physics.
  • Familiarity with process certification and reliability risk assessment.
  • Hands-on experience with Etest, Sort, and Class data extraction and analysis.
  • Proficiency in statistical tools (JMP).
  • Strong presentation and communication skills.
  • Six Sigma certification and prior experience in quality/reliability engineering are a plus.

Behavioral Traits-

  • High tolerance for ambiguity and ability to define strategies efficiently.
  • Self-starter with a willingness to take informed risks.
  • Advanced problem-solving and analytical skills.
  • Excellent communication, presentation, and time management skills.

Job Type:

Experienced Hire

Shift:

Shift 1 (India)

Primary Location: 

India, Bangalore

Additional Locations:

Business group:

The Silicon Engineering Group (SIG) is a worldwide organization focused on the development and integration of SOCs, Cores, and critical IPs from architecture to manufacturing readiness that power Intel’s leadership products. This business group leverages an incomparable mix of experts with different backgrounds, cultures, perspectives, and experiences to unleash the most innovative, amazing, and exciting computing experiences.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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