Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and deliver trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.

As Microsoft's cloud business continues to grow, the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Hardware, Infrastructure Management, and Fundamentals Engineering (HIFE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Senior Manufacturing Test Engineer to join our team. Join us in this exciting AI revolution. Be part of the infrastructure engineering taskforce to fuel this world changing mission.

#azurehwjobs #HIFE #AHSI #CHIE

As a Senior Manufacturing Test Engineer, you will define and implement manufacturing test methodologies to verify product functionality following assembly of building blocks (PCBAs, storage enclosures) and system integrations (blade/rack assemblies) across ODM/System Integrator/Contract Manufacturer sites. Your scope spans NPI through sustaining, with accountability for test hardware/software/firmware readiness, high test coverage, and yield-driven improvements.

• Define and execute manufacturing test methodologies for building blocks (PCBA + storage enclosure) and system assemblies across ODM/SI/CM sites (NPI + sustaining).

• Own building-block test development for ICT (In‑Circuit Test) and BFT (Board Functional Test)—coverage definition, fixture/test station readiness, and release execution for PCBAs and enclosure boards

• Develop/validate/sustain test HW/SW/FW tools, scripts, fixtures, and procedures to meet product requirements and manufacturing constraints.

• Build and maintain stable core test content (reusable scripts/cases) and deploy to blade/rack-level stations; perform agile onsite debugging when needed.

• Own disciplined test-content release process (validation/regression, change control, rollback readiness) to protect factory uptime and quality.

• Provide test readiness judgment for NPI builds (HW/SW/FW), identify early risks, and drive mitigations/closure with partners.

• Monitor production yield/test data, deep-dive test issues, and drive continuous improvements to reduce escapes and improve quality.

• Drive root-cause remediation for systemic HW/FW issues found in manufacturing; align with reliability/qualification for coverage parity.

• Optimize test flows for throughput and cost without compromising quality; factor CM/ODM capacity/capability constraints and supply continuity.

Required qualifications:

• Doctorate in Electrical Engineering, Computer Science, Mechanical Engineering (Hardware) or related field OR Master's Degree in Electrical Engineering, Computer Science, Mechanical Engineering (Hardware) or related field AND 3+ years enterprise computer, consumer electronics design or hyperscale supply chain systems experience OR Bachelor's Degree in Electrical Engineering, Computer Science, Mechanical Engineering (Hardware) or related field
  • 4+ years enterprise computer, consumer electronics design or hyperscale supply chain systems experience
  • OR equivalent experience

Other Requirements:

• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter

Preferred qualifications:

• Bachelor’s Degree in Electrical Engineering, Computer Science, Mechanical Engineering (Hardware) or related field AND 4+ years enterprise computer, consumer electronics design, or hyperscale supply chain systems experience OR
• Master’s Degree in Electrical Engineering, Computer Science, Mechanical Engineering (Hardware) or related field AND 3+ years enterprise computer, consumer electronics design, or hyperscale supply chain systems experience OR
• Doctorate in Electrical Engineering, Computer Science, Mechanical Engineering (Hardware) or related field OR equivalent experience.
• 2+ years hands‑on experience leading or owning manufacturing test development projects, including CPU/GPU test tools deployed into factory flows
• Proven experience developing and validating manufacturing test hardware, software, and/or firmware for PCBAs, enclosures, blade, or rack‑level systems
• Strong proficiency in Linux environments, including scripting, command‑line operation, and on‑site debug in factory or lab settings
• Experience supporting NPI manufacturing readiness, including test coverage definition, risk identification, and mitigation execution
• Demonstrated ability to analyze production yield and test data, perform root‑cause analysis, and drive corrective actions
• Ability to collaborate effectively with cross‑functional teams (hardware, firmware, reliability, operations, CM/ODM partners) in a manufacturing environment
• Experience with building‑block manufacturing tests, including ICT (In‑Circuit Test) and BFT (Board Functional Test) development, fixtures, and station readiness for PCBA and enclosure
• Knowledge of rack‑level and blade‑level test frameworks, sequencing, and factory automation methodologies
• Familiarity with GPU‑based platforms, high‑speed interconnects, and system‑level diagnostics in manufacturing contexts
• Experience with FW/BIOS, driver development, or low‑level hardware validation tooling
• Proficiency in one or more programming languages such as Python, C/C++, C#, SQL, or Rust for test automation or data analysis
• Experience using Azure DevOps, BI tools, or automation platforms to track test effectiveness, coverage, and quality metrics
• Exposure to CM/ODM manufacturing environments, including capacity constraints, fixture scaling, and production ramp support

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.